Cypress Semiconductor CY7C1381D Uživatelský manuál stáhnout pdf (Strana 20)

CY7C1381D

CY7C1383D

Document #: 38-05544 Rev. *E Page 19 of 29

Capacitance

[19]

Parameter Description Test Conditions

100 TQFP

Package

119 BGA

Package

165 FBGA

Package Unit

Input Capacitance T

= 25°C, f = 1 MHz,

= 3.3V.

DDQ

= 2.5V

589pF

CLK

Clock Input Capacitance 5 8 9 pF

I/O

Input/Output Capacitance 5 8 9 pF

Thermal Resistance

[19]

Parameter Description Test Conditions

100 TQFP

Package

119 BGA

Package

165 FBGA

Package Unit

Thermal Resistance

(Junction to Ambient)

Test conditions follow

standard test methods and

procedures for measuring

thermal impedance, per

EIA/JESD51.

28.66 23.8 20.7 °C/W

Thermal Resistance

(Junction to Case)

4.08 6.2 4.0 °C/W

AC Test Loads and Waveforms

Note:

18. Tested initially and after any design or process change that may affect these parameters.

OUTPUT

R = 317Ω

R = 351Ω

5pF

INCLUDING

JIG AND

SCOPE

(a) (b)

OUTPUT

= 50Ω

= 1.5V

3.3V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

≤ 1 ns

(c)

OUTPUT

R = 1667Ω

R = 1538Ω

5pF

INCLUDING

JIG AND

SCOPE

(a) (b)

OUTPUT

= 50Ω

= 1.25V

2.5V

ALL INPUT PULSES

DDQ

GND

90%

10%

90%

10%

≤ 1 ns

(c)

3.3V I/O Test Load

2.5V I/O Test Load

1 2 ... 15 16 17 18 19 20 21 22 23 24 25 ... 29 30

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