Cypress Semiconductor enCoRe CY7C64215 Uživatelský manuál stáhnout pdf (Strana 28)

CY7C64215

Document Number: 38-08036 Rev. *E Page 28 of 33

Packaging Information

This section illustrates the package specification for the CY7C64215 enCoRe III, along with the thermal impedance for the package.

Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of

the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at

http://www.cypress.com/design/MR10161.

Package Diagrams

Figure 9. 56-Pin (8x8 mm) QFN-MLF (PUNCH)

001-12921 *A

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Cypress Semiconductor enCoRe CY7C64215 Uživatelský manuál Strana 28