Cypress Semiconductor CY8C21234 Uživatelský manuál stáhnout pdf (Strana 6)

April 20, 2005 Document No. 38-12025 Rev. *G 32

CY8C21x34 Final Data Sheet 4. Packaging Information

Figure 4-4. 32-Lead (5x5 mm) MLF

Important Note For information on the preferred dimensions for mounting MLF packages, see the following Application Note at

http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.

4.2 Thermal Impedances

Table 4-1. Thermal Impedances per Package

Package Typical θ

* Typical θ

16 SOIC

123

C/W 55

C/W

20 SSOP

117

C/W 41

C/W

28 SSOP

C/W 39

C/W

32 MLF

C/W 12

C/W

* T

= T

+ Power x θ

51-85188 **

E-PAD X, Y for this product is 3.71 mm, 3.71 mm (+/-0.08 mm)

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Cypress Semiconductor CY8C21234 Uživatelský manuál Strana 6