Cypress Semiconductor CY7C141 Datový list

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36-Mbit QDR
®
II SRAM 2-Word
Burst Architecture
CY7C1412BV18
CY7C1414BV18
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document #: 001-07036 Rev. *E Revised August 24, 2009
Features
Separate independent Read and Write Data Ports
Supports concurrent transactions
250 MHz clock for high bandwidth
2-word burst on all accesses
Double Data Rate (DDR) interfaces on both read and write ports
(data transferred at 500 MHz) at 250 MHz
Two input clocks (K and K) for precise DDR timing
SRAM uses rising edges only
Two input clocks for output data (C and C) to minimize clock
skew and flight time mismatches
Echo clocks (CQ and CQ) simplify data capture in high-speed
systems
Single multiplexed address input bus latches address inputs
for both read and write ports
Separate port selects for depth expansion
Synchronous internally self-timed writes
QDR
®
II operates with 1.5 cycle read latency when Delay Lock
Loop (DLL) is enabled
Operates as a QDR I device with 1 cycle read latency in DLL
off mode
Available in x 18, and x 36 configurations
Full data coherency, providing most current data
Core V
DD
= 1.8V (±0.1V); I/O V
DDQ
= 1.4V to V
DD
Available in 165-Ball FBGA package (15 x 17 x 1.4 mm)
Offered in both Pb-free and non Pb-free packages
Variable drive HSTL output buffers
JTAG 1149.1 compatible test access port
Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1412BV18 – 2M x 18
CY7C1414BV18 – 1M x 36
Functional Description
The CY7C1412BV18, and CY7C1414BV18 are 1.8V
Synchronous Pipelined SRAMs, equipped with QDR II archi-
tecture. QDR II architecture consists of two separate ports: the
read port and the write port to access the memory array. The
read port has data outputs to support read operations and the
write port has data inputs to support write operations. QDR II
architecture has separate data inputs and data outputs to
completely eliminate the need to ‘turnaround’ the data bus
required with common I/O devices. Access to each port is
accomplished through a common address bus. The read
address is latched on the rising edge of the K clock and the write
address is latched on the rising edge of the K
clock. Accesses to
the QDR II read and write ports are completely independent of
one another. To maximize data throughput, both read and write
ports are provided with DDR interfaces. Each address location
is associated with two 18-bit words (CY7C1412BV18), or 36-bit
words (CY7C1414BV18) that burst sequentially into or out of the
device. Because data can be transferred into and out of the
device on every rising edge of both input clocks (K and K
and C
and C), memory bandwidth is maximized while simplifying
system design by eliminating bus ‘turnarounds’.
Depth expansion is accomplished with port selects, which
enables each port to operate independently.
All synchronous inputs pass through input registers controlled by
the K or K
input clocks. All data outputs pass through output
registers controlled by the C or C
(or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
Selection Guide
Description 250 MHz 200 MHz 167 MHz Unit
Maximum Operating Frequency 250 200 167 MHz
Maximum Operating Current x18 850 725 650 mA
x36 1000 850 740
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Strany 1 - Burst Architecture

36-Mbit QDR® II SRAM 2-WordBurst ArchitectureCY7C1412BV18CY7C1414BV18Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709

Strany 2

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 10 of 24IEEE 1149.1 Serial Boundary Scan (JTAG)These SRAMs incorporate a serial boundary sc

Strany 3

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 11 of 24IDCODEThe IDCODE instruction loads a vendor-specific, 32-bit code intothe instructi

Strany 4

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 12 of 24TAP Controller State DiagramThe state diagram for the TAP controller follows.[9]TES

Strany 5

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 13 of 24TAP Controller Block DiagramTAP Electrical Characteristics Over the Operating Range

Strany 6

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 14 of 24TAP AC Switching Characteristics Over the Operating Range[13, 14]Parameter Descript

Strany 7

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 15 of 24Identification Register Definitions Instruction FieldValueDescriptionCY7C1412BV18 C

Strany 8

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 16 of 24Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bump ID0 6R 28

Strany 9

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 17 of 24Power Up Sequence in QDR II SRAMQDR II SRAMs must be powered up and initialized in

Strany 10 - CY7C1414BV18

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 18 of 24Maximum RatingsExceeding maximum ratings may impair the useful life of thedevice. T

Strany 11

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 19 of 24ISB1Automatic Power down CurrentMax VDD, Both Ports Deselected, VIN ≥ VIH or VIN ≤

Strany 12

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 2 of 24Logic Block Diagram (CY7C1412BV18)Logic Block Diagram (CY7C1414BV18)1M x 18 ArrayCLK

Strany 13

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 20 of 24Switching Characteristics Over the Operating Range[20, 21]CypressParameterConsortiu

Strany 14

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 21 of 24Switching WaveformsFigure 5. Read/Write/Deselect Sequence[26, 27, 28]K1234581067KR

Strany 15

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 22 of 24Ordering InformationThe table below contains only the parts that are currently avai

Strany 16

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 23 of 24Package DiagramFigure 6. 165-Ball FBGA (15 x 17 x 1.4 mm), 51-85195A1PIN 1 CORNER17

Strany 17

Document #: 001-07036 Rev. *E Revised August 24, 2009 Page 24 of 24QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cyp

Strany 18

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 3 of 24Pin Configuration The pin configuration for CY7C1412BV18 and CY7C1414BV18 follow.[1]

Strany 19

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 4 of 24Pin Definitions Pin Name I/O Pin DescriptionD[x:0]Input-SynchronousData Input Signal

Strany 20

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 5 of 24DOFFInput DLL Turn Off − Active LOW. Connecting this pin to ground turns off the DLL

Strany 21

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 6 of 24Functional OverviewThe CY7C1412BV18, and CY7C1414BV18 are synchronouspipelined Burst

Strany 22

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 7 of 24Programmable ImpedanceAn external resistor, RQ, must be connected between the ZQ pin

Strany 23

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 8 of 24Truth TableThe truth table for CY7C1412BV18, and CY7C1414BV18 follows.[2, 3, 4, 5, 6

Strany 24

CY7C1412BV18CY7C1414BV18Document #: 001-07036 Rev. *E Page 9 of 24Write Cycle DescriptionsThe write cycle description table for CY7C1414BV18 follows.[

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